Contact resistance between via and conductive line

ABSTRACT

A method includes forming a first conductive feature on a substrate, forming a via that contacts the first conductive feature, the via comprising a conductive material, performing a Chemical Mechanical Polishing (CMP) process to a top surface of the via, depositing an Interlayer Dielectric (ILD) layer on the via, forming a trench within the ILD layer to expose the via, and filling the trench with a second conductive feature that contacts the via, the second conductive feature comprising a same material as the conductive material.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs. Such scaling down has also increased the complexity ofIC structures (such as three-dimensional transistors) and processingand, for these advancements to be realized, similar developments in ICprocessing and manufacturing are needed. For example, device performance(such as device performance degradation associated with various defects)and fabrication cost of field-effect transistors become more challengingwhen device sizes continue to decrease. Although methods for addressingsuch a challenge have been generally adequate, they have not beenentirely satisfactory in all aspects.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1I, and 1J are diagrams showing anillustrative process for forming a via and conductive line with animproved contact resistance between the two, according to one example ofprinciples described herein.

FIG. 2 is a diagram showing a tapering angle of the via, according toone example of principles described herein.

FIGS. 3A, 3B, and 3C are diagrams showing illustrative sizerelationships between via and conductive line, according to one exampleof principles described herein.

FIG. 4 is a flowchart showing an illustrative method for forming a viaand conductive line with an improved contact resistance between the two,according to one example of principles described herein.

FIG. 5 is a flowchart showing an illustrative method for forming a viaand conductive line with an improved contact resistance between the two,according to one example of principles described herein.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The present disclosure is generally related to semiconductor devices andthe fabrication thereof, and more particularly to semiconductor deviceswith improved resistance between a via and a conductive feature.

In conventional semiconductor fabrication processes, the Back End ofLine (BEOL) involves the formation of several dielectric layers, eachdielectric layer having conductive lines (e.g., metal lines) disposedtherein. The metal lines disposed within one dielectric layer areconnected to metal lines disposed within another dielectric layerthrough a via. A via is formed by depositing a conductive material, suchas copper or tungsten within a trench formed into a dielectric layer.Then, a subsequent dielectric layer is formed, and patterned to formanother trench that exposes the underlying via. Another conductivematerial is then deposited into the recently formed trench to form ametal line. To avoid the metal layer from diffusing into the dielectriclayer, a barrier layer (often made of titanium nitride or tantalumnitride) is then disposed within the recently formed trench before themetal material is deposited therein. This barrier layer, however, addsresistance to the interface between the via and the conductive line. Insome instances, multiple layers are between the metal layer anddielectric layer, such as a glue layer (also called as an adhesionlayer, in some instances) and a barrier layer. It is desirable toimprove this resistance by reducing or eliminating it.

According to principles described herein, the contact resistance betweena via and a conductive line is improved by reducing or eliminating theinterface between the via and the conductive line. This may be done byusing the same type of conductive material for the via as the conductiveline. For example, both the via and the conductive line may both beformed of ruthenium. Ruthenium may be referred to as a barrier-freemetal because it is able to be deposited within a dielectric layerwithout using a barrier layer between the conductive line and thedielectric layer within which it is formed. Using principles describedherein, the contact resistance between the via and the conductive lineis improved by reducing or eliminating such contact resistance. Thisallows the circuit to be more efficient and function better.

FIGS. 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1I, and 1J are diagrams showing anillustrative process for forming a via and conductive line with animproved contact resistance between the two. According to the presentexample, a semiconductor device includes a substrate 102 and a firstdielectric layer 104.

The semiconductor substrate 102 may be a silicon substrate. Thesemiconductor substrate may be part of a silicon wafer. Othersemiconductor materials are contemplated. The substrate 102 may includean elementary (single element) semiconductor, such as silicon,germanium, and/or other suitable materials; a compound semiconductor,such as silicon carbide, gallium arsenic, gallium phosphide, indiumphosphide, indium arsenide, indium antimonide, and/or other suitablematerials; an alloy semiconductor, such as SiGe, GaAsP, AlInAs, AlGaAs,GaInAs, GaInP, GaInAsP, and/or other suitable materials. The substrate102 may be a single-layer material having a uniform composition.Alternatively, the substrate 102 may include multiple material layershaving similar or different compositions suitable for IC devicemanufacturing. In one example, the substrate 102 may be asilicon-on-insulator (SOI) substrate having a silicon layer formed on asilicon oxide layer. In another example, the substrate 102 may include aconductive layer, a semiconductor layer, a dielectric layer, otherlayers, or combinations thereof.

The dielectric layer 104 includes two types of sublayers. In oneexample, the first sublayer 104 a is silicon dioxide and the secondsublayer 104 b is silicon nitride. Other types of dielectric materialsare contemplated. The dielectric layer 104 (and thus the sublayers 104a, 104 b) may be formed through various deposition processes.

FIG. 1B illustrates the formation of a trench 106 within the firstdielectric layer 104. The trench 106 may be formed usingphotolithographic patterning techniques. For example, in the presentexample, the trench is formed by lithography patterning and etching. Aphotoresist (or resist) layer used to define the trench may be formed onthe first dielectric layer. A resist layer includes a photosensitivematerial that causes the layer to undergo a property change when exposedto light, such as ultraviolet (UV) light, deep UV (DUV) light or extremeUV (EUV) light. This property change can be used to selectively removeexposed or unexposed portions of the resist layer by a developingprocess. This procedure to form a patterned resist layer is alsoreferred to as lithographic patterning or lithography process. In oneembodiment, the resist layer is patterned to leave the portions of thephotoresist material by the lithography patterning process. Afterpatterning the resist layer, an etching process is performed on thesemiconductor structure to open the first dielectric layer 104 and formthe trench 106, thereby transferring the openings from the resist layerto the first dielectric layer. The remaining resist layer may be removedafter patterning the first dielectric layer by wet stripping or plasmaashing. In some examples, a lithography process includes spin-on coatinga resist layer, soft baking of the resist layer, mask aligning,exposing, post-exposure baking, developing the resist layer, rinsing,and drying (e.g., hard baking). Alternatively, a lithographic processmay be implemented, supplemented, or replaced by other methods such asmaskless photolithography, electron-beam writing, and ion-beam writing.The etching process to pattern the first dielectric layer 104 mayinclude wet etching, dry etching or a combination thereof. The etchingprocess may include multiple etching steps.

FIG. 1C illustrates the formation of a first conductive feature 108within the first dielectric layer 104. The first conductive feature 108may be formed in a variety of manners. In one example, the firstconductive feature 108 is formed by depositing a metal material, such astungsten, within the trench 106. A Chemical Mechanical Polishing (CMP)process may then be applied to the deposited metal material to planarizethe top surface of the conductive feature 108 with the top surface ofthe first dielectric layer 104.

Although not shown in FIG. 1C, the first conductive feature 108 may beelectrically connected to a feature within the substrate 102 through avia (also not shown). For example, the first conductive feature may beconnected to a source, drain, or gate feature of a transistor within thesubstrate. In examples in which the substrate includes dielectric layerswhich are also part of the BEOL, the conductive feature 108 may connectto an underlying conductive feature.

FIG. 1D illustrates the formation of a second dielectric layer 110. Thesecond dielectric layer 110 also includes a number of sublayers 110 a,110 b. The first sublayer 110 a may be silicon dioxide and the secondsublayer 110 b may be silicon nitride. Other types of dielectricmaterials are contemplated. The dielectric layer 110 (and thus thesublayers 110 a, 110 b) may be formed through various depositionprocesses.

FIG. 1E illustrates the formation of a trench 112 within the seconddielectric layer 110. The trench 112 may be formed usingphotolithographic patterning techniques. For example, in the presentexample, the trench is formed by lithography patterning and etching. Aphotoresist (or resist) layer used to define the trench may be formed onthe first dielectric layer. A resist layer includes a photosensitivematerial that causes the layer to undergo a property change when exposedto light, such as ultraviolet (UV) light, deep UV (DUV) light or extremeUV (EUV) light. This property change can be used to selectively removeexposed or unexposed portions of the resist layer by a developingprocess. This procedure to form a patterned resist layer is alsoreferred to as lithographic patterning or lithography process. In oneembodiment, the resist layer is patterned to leave the portions of thephotoresist material by the lithography patterning process. Afterpatterning the resist layer, an etching process is performed on thesemiconductor structure to open the second dielectric layer 110 and formthe trench 112, thereby transferring the openings from the resist layerto the first dielectric layer. The remaining resist layer may be removedafter patterning the first dielectric layer by wet stripping or plasmaashing. In some examples, a lithography process includes spin-on coatinga resist layer, soft baking of the resist layer, mask aligning,exposing, post-exposure baking, developing the resist layer, rinsing,and drying (e.g., hard baking). Alternatively, a lithographic processmay be implemented, supplemented, or replaced by other methods such asmaskless photolithography, electron-beam writing, and ion-beam writing.The etching process to pattern the second dielectric layer 110 mayinclude wet etching, dry etching or a combination thereof. The etchingprocess may include multiple etching steps.

FIG. 1F illustrates the deposition of a conductive material 114 withinthe trench 112. The conductive material 114 may be one of a variety ofmetal materials such as ruthenium, tungsten, cobalt, or copper. In oneparticular example, the conductive material 114 comprises ruthenium. Theruthenium may be deposited using a Chemical Vapor Deposition (CVD)process. The CVD process may use Ru₃Co₁₂ as a precursor. The CVD processmay be performed at a temperature within a range of about 100-200degrees Celsius. This range is ideal for depositing the conductivematerial within the trench. If the temperature is too high or too low,the conductive material may not form properly. In some examples, otherdeposition techniques such as Plasma Vapor Deposition (PVD) or AtomicLayer Deposition (ALD) may be used.

FIG. 1G illustrates a CMP process 115 that is performed on theconductive material to form a via 116. The CMP process planarizes thesurface of the water so that the top surface of the via is coplanar withthe top surface of the second dielectric layer 110. The via 116 directlycontacts the underlying feature 108 and thus provides an electricalconnection to the underlying conductive feature 108. After the CMPprocess, the via 116 may have a height within a range of 10-30nanometers. The bottom of the via may have a critical dimension withrespect to adjacent vias of about 5-15 nanometers.

FIG. 1H illustrates the formation of a third dielectric layer 118. Thethird dielectric layer 118 also comprises several sublayers. In someexamples, the third dielectric layer 118 may be referred to as anInterlayer Dielectric (ILD) layer. In the present case, the thirddielectric layer comprises an etch stop layer 118 a, a low-k dielectriclayer 118 b, and a hard mask layer 118 c. In some examples, the thirddielectric layer 118 may include only the etch stop layer 118 a and thelow-k dielectric layer 118 b. In some examples, the third dielectriclayer may include only the low-k dielectric layer 118 b. The dielectriclayer 118 (and thus the sublayers 118 a, 118 b, 118 c) may be formedthrough various deposition processes.

FIG. 1I illustrates the formation of a trench 120 within the thirddielectric layer 118. The trench 120 may be formed usingphotolithographic patterning techniques. For example, in the presentexample, the trench is formed by lithography patterning and etching. Aphotoresist (or resist) layer used to define the trench may be formed onthe first dielectric layer. A resist layer includes a photosensitivematerial that causes the layer to undergo a property change when exposedto light, such as ultraviolet (UV) light, deep UV (DUV) light or extremeUV (EUV) light. This property change can be used to selectively removeexposed or unexposed portions of the resist layer by a developingprocess. This procedure to form a patterned resist layer is alsoreferred to as lithographic patterning or lithography process. In oneembodiment, the resist layer is patterned to leave the portions of thephotoresist material by the lithography patterning process. Afterpatterning the resist layer, an etching process is performed on thesemiconductor structure to open the third dielectric layer 118 and formthe trench 120, thereby transferring the openings from the resist layerto the first dielectric layer. The remaining resist layer may be removedafter patterning the first dielectric layer by wet stripping or plasmaashing. In some examples, a lithography process includes spin-on coatinga resist layer, soft baking of the resist layer, mask aligning,exposing, post-exposure baking, developing the resist layer, rinsing,and drying (e.g., hard baking). Alternatively, a lithographic processmay be implemented, supplemented, or replaced by other methods such asmaskless photolithography, electron-beam writing, and ion-beam writing.The etching process to pattern the third dielectric layer 118 mayinclude wet etching, dry etching or a combination thereof. The etchingprocess may include multiple etching steps.

FIG. 1J illustrates the formation of a second conductive feature 122within the trench 120. The second conductive feature may also bedeposited using the same process used to form the via 116. Additionally,the second conductive feature may include the same type of conductivematerial as the via 116. Specifically, if the via 116 is made ofruthenium, then the second conductive feature 122 may also be made ofruthenium. Ruthenium is one of a number of materials that providesparticular advantages in this situation because it can be deposited intothe trench 120 without first forming a barrier layer to protect againstdiffusion of the metal into the third dielectric layer 118. Theruthenium may also adhere well to the surface of the third dielectriclayer 118 without having to rely on a barrier or glue layer. By nothaving a barrier or glue layer, there is no interface between the secondconductive feature 122 and the via 116. Without such an interface, thecontact resistance between the via 116 and the second conductive feature122 is reduced or eliminated. In some embodiments, the second conductivefeature 122 extends along the direction of the gate feature. In someembodiments, the second conductive feature 122 extends along thedirection of a fin structure of a FinFET. In other words, the secondconductive feature 122 extends along the direction of the channelfeature.

FIG. 2 is a diagram showing a tapering angle of the via. When usingprinciples described herein, the via 116 will be tapered at a relativelysteep angle. Specifically, the angle between the bottom surface of thevia (or top surface of the underlying conductive feature 108) and thevia 116 is greater than 85 degrees. Thus, the structure of the via isdifferent than a structure produced using conventional dual damasceneprocesses. In some embodiments, an interface exists between the via 116and the second conductive feature 122.

FIGS. 3A, 3B, and 3C are diagrams showing illustrative sizerelationships between via and conductive line. FIGS. 3A-3C illustrate atop view of the first conductive feature 108, the via 116, and thesecond conductive feature 122. As can be seen in the example of FIG. 3A,the diameter 304 of the via 116 is greater than the width 302 of thesecond conductive feature 122. FIG. 3B illustrates an example in whichthe diameter 304 of the via 116 is similar to the width 302 of thesecond conductive feature 122. FIG. 3C illustrates an example in whichthe diameter 304 of the via 116 is less than the width 302 of the secondconductive feature 122. In some examples, the second conductive feature122 may have a length within a range of about 5-150 nanometers.

FIG. 4 is a flowchart showing an illustrative method 400 for forming avia and conductive line with an improved contact resistance between thetwo. According to the present example, the method includes a process 402for forming a first conductive feature (e.g., 108) on a substrate (e.g.,102). More specifically, the first conductive feature may be formedwithin a dielectric layer that has been deposited on the substrate.

The first conductive feature may be formed in a variety of manners. Inone example, the first conductive feature is formed by depositing ametal material, such as tungsten, within a trench. A Chemical MechanicalPolishing (CMP) process may then be applied to the deposited metalmaterial to planarize the top surface of the conductive feature with thetop surface of the dielectric layer. The first conductive feature may beelectrically connected to a feature within the substrate through a via.For example, the first conductive feature may be connected to a source,drain, or gate feature of a transistor within the substrate. In examplesin which the substrate includes dielectric layers which are also part ofthe BEOL, the first conductive feature may connect to an underlyingconductive feature.

The method 400 further includes a process 404 for, in a first process,forming a via (e.g., 116) that contacts the first conductive feature,the via comprising a conductive material. In one example, the viaincludes ruthenium. The via may be formed within another dielectriclayer. The via may be formed by deposition of a conductive materialwithin a trench. The conductive material may be one of a variety ofmetal materials such as ruthenium, tungsten, cobalt, or copper. In oneparticular example, the conductive material comprises ruthenium. Theruthenium may be deposited using a first CVD process. The first CVDprocess may use Ru₃Co₁₂ as a precursor. The CVD process may be performedat a temperature within a range of about 100-200 degrees Celsius.

The method 400 further includes a process for forming a CMP process(e.g., 115) to a top surface of the via. The CMP process planarizes thesurface of the water so that the top surface of the via is coplanar withthe top surface of the dielectric layer. The via directly contacts theunderlying feature and thus provides an electrical connection to theunderlying first conductive feature. After the CMP process, the via mayhave a height within a range of 10-30 nanometers. The bottom of the viamay have a critical dimension with respect to adjacent vias of about5-15 nanometers.

The method 400 further includes a process 408 for forming an InterlayerDielectric (ILD) layer (e.g., 118) on the via. In some examples, the ILDlayer also comprises several sublayers. In one example, the ILD layercomprises an etch stop layer (e.g., 118 a), a low-k dielectric layer(e.g., 118 b), and a hard mask layer (e.g., 118 c). In some examples,the ILD layer may include only the etch stop layer and the low-kdielectric layer.

The method 400 further includes a process 412 for forming a trench(e.g., 120) within the ILD layer to expose the via. The trench may beformed using photolithographic patterning techniques. For example, aphotoresist may be placed on top of the ILD layer. The photoresist maybe used to photolithographically pattern the ILD layer. For example, thephotoresist may be exposed to a light source through a photomask. Thephotomask may then be developed such that the portions of thephotoresist where the trench is to be are removed and other portions ofthe photoresist remain. An etching process may then be applied to theexposed portion of the ILD layer to form the trench.

The method 400 further includes a process 412 for, in a second process,forming within the trench a second conductive feature (e.g., 122) thatcontacts the via, the second conductive feature comprising a samematerial as the conductive material. The second conductive feature mayalso be deposited using the same process used to form the via.Additionally, the second conductive feature may include the same type ofconductive material as the via. Specifically, if the via is made ofruthenium, then the second conductive feature may also be made ofruthenium. Ruthenium is one of a number of materials that providesparticular advantages in this situation because it can be deposited intothe trench without first forming a barrier layer to protect againstdiffusion of the metal into the ILD layer. The ruthenium may also adherewell to the surface of the ILD layer without having to rely on a barrieror glue layer. By not having a barrier or glue layer, there is nointerface between the second conductive feature and the via. Withoutsuch an interface, the contact resistance between the via and the secondconductive feature is reduced or eliminated.

FIG. 5 is a flowchart showing an illustrative method for forming a viaand conductive line with an improved contact resistance between the two.According to the present example, the method 500 includes a process 502for forming a first dielectric layer (e.g., 104) on a substrate (e.g.102). The semiconductor substrate may be a silicon substrate. Thesemiconductor substrate may be part of a silicon wafer. Othersemiconductor materials are contemplated. The substrate may include anelementary (single element) semiconductor, such as silicon, germanium,and/or other suitable materials; a compound semiconductor, such assilicon carbide, gallium arsenic, gallium phosphide, indium phosphide,indium arsenide, indium antimonide, and/or other suitable materials; analloy semiconductor, such as SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP,GaInAsP, and/or other suitable materials. The substrate may be asingle-layer material having a uniform composition. Alternatively, thesubstrate may include multiple material layers having similar ordifferent compositions suitable for IC device manufacturing. In oneexample, the substrate may be a silicon-on-insulator (SOI) substratehaving a silicon layer formed on a silicon oxide layer. In anotherexample, the substrate may include a conductive layer, a semiconductorlayer, a dielectric layer, other layers, or combinations thereof.

The dielectric layer may include two types of sublayers. In one example,the first sublayer (e.g., 104 a) is silicon dioxide and the secondsublayer (e.g., 104 b) is silicon nitride. Other types of dielectricmaterials are contemplated. The dielectric layer (and thus thesublayers) may be formed through various deposition processes.

The method 500 further includes a process 504 for forming a via (e.g.,116) within a first dielectric layer. In one example, the via includesruthenium. The via may be formed within another dielectric layer. Thevia may be formed by deposition of a conductive material within atrench. The conductive material may be one of a variety of metalmaterials such as ruthenium, tungsten, cobalt, or copper. In oneparticular example, the conductive material comprises ruthenium. Theruthenium may be deposited using a first CVD process. The first CVDprocess may use Ru₃Co₁₂ as a precursor. The CVD process may be performedat a temperature within a range of about 100-200 degrees Celsius.

The method 500 further includes a process 506 for forming a seconddielectric layer (e.g., 110) on the first dielectric layer and the via.The second dielectric layer may also include a number of sublayers. Thefirst sublayer (e.g., 110 a) may be silicon dioxide and the secondsublayer (e.g., 110 b) may be silicon nitride. Other types of dielectricmaterials are contemplated. The dielectric layer (and thus thesublayers) may be formed through various deposition processes.

The method 500 further includes a process 508 for forming a conductivefeature within the second dielectric layer, the conductive featurecomprising a same type of conductive material as the via. The secondconductive feature may also be deposited using the same type of processused to form the via. However, it is a separate process that is distinctfrom the process used to form the via. Specifically, other processes areperformed between formation of the via and formation of the secondconductive feature. For example, deposition of the second dielectriclayer is performed after forming the via but before forming the secondconductive material.

Additionally, the second conductive feature may include the same type ofconductive material as the via. Specifically, if the via is made ofruthenium, then the second conductive feature may also be made ofruthenium. Ruthenium is one of a number of materials that providesparticular advantages in this situation because it can be deposited intothe trench without first forming a barrier layer to protect againstdiffusion of the metal into the ILD layer. The ruthenium may also adherewell to the surface of the ILD layer without having to rely on a barrieror glue layer. By not having a barrier or glue layer, there is nointerface between the second conductive feature and the via. Withoutsuch an interface, the contact resistance between the via and the secondconductive feature is reduced or eliminated.

Thus, by applying principles described herein, the contact resistancebetween a via and a conductive line is improved by reducing oreliminating the interface between the via and the conductive line.Specifically, this advantage is realized by using the same type ofconductive material for the via as the conductive line. For example,both the via and the conductive line may both be formed of ruthenium.Ruthenium may be referred to as a barrier-free metal because it is ableto be deposited within a dielectric layer without using a barrier layerbetween the conductive line and the dielectric layer within which it isformed. Thus, using principles described herein, the contact resistancebetween the via and the conductive line is improved by reducing oreliminating such contact resistance. This allows the circuit to be moreefficient and function better.

Moreover, using the fabrication techniques described herein, a structureis produced that is different and distinguishable from structuresproduced using conventional fabrication techniques. For example, the viawill be tapered at a relatively steep angle when using the fabricationtechniques described herein. Specifically, the angle between the bottomsurface of the via (or top surface of the underlying conductive feature108) and the via 116 is greater than 85 degrees. Thus, the structure ofthe via is different than a structure produced using conventional dualdamascene processes. Additionally, using the techniques describedherein, structures can be produced such that the diameter of the via isgreater than the width of the second conductive feature. While thetechniques allow for such a structure, other structures may result. Forexample, the diameter of the via may be similar to the width of thesecond conductive feature. Or, the diameter of the via may be less thanthe width of the second conductive feature.

According to one example, a method includes forming a first conductivefeature on a substrate, forming a via that contacts the first conductivefeature, the via comprising a conductive material, performing a ChemicalMechanical Polishing (CMP) process to a top surface of the via,depositing an Interlayer Dielectric (ILD) layer on the via, forming atrench within the ILD layer to expose the via, and filling the trenchwith a second conductive feature that contacts the via, the secondconductive feature comprising a same material as the conductivematerial.

According to one example, a method includes forming a first dielectriclayer on a substrate, in a first process, forming a via within a firstdielectric layer, forming a second dielectric layer on the firstdielectric layer and the via, in a second process that is different thanthe first process, and forming a conductive feature within the seconddielectric layer, the conductive feature comprising a same type ofconductive material as the via.

According to one example, a semiconductor device includes a substrate, afirst dielectric layer formed on the substrate, a first conductivefeature formed within the first dielectric layer, a second dielectriclayer on the first dielectric layer, a via disposed within the seconddielectric layer, the via having a sidewall angle that is greater than85 degrees from the top surface of the first dielectric layer, a thirddielectric layer on the second dielectric layer, and a second conductivefeature formed within the third dielectric layer, wherein the secondconductive feature comprises a same conductive material as the via.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming a first conductivefeature on a substrate; forming, by a first process, a via that contactsthe first conductive feature, the via formed of a metal material;performing a Chemical Mechanical Polishing (CMP) process to a topsurface of the via; depositing an Interlayer Dielectric (ILD) layer onthe via; forming a trench within the ILD layer to expose the via; andfilling, by a second process that is different that the first process,the trench with the metal material to form a second conductive featurethat contacts the via, wherein the metal material of the secondconductive feature completely fills the trench and physically contactsthe ILD layer, wherein the metal material is filled within the trenchwithout a barrier layer being disposed within the trench prior to thefilling of the trench with the metal material to form the secondconductive feature.
 2. The method of claim 1, wherein the metal materialcomprises a barrier-free metal.
 3. The method of claim 1, whereinlateral boundaries of the second conductive feature are not aligned withlateral boundaries of the via with respect to a top view.
 4. The methodof claim 3, wherein the via is deposited using at least one of: aChemical Vapor Deposition (CVD) process, a Plasma Vapor Deposition (PVD)process, or an Atomic Layer Deposition (ALD) process.
 5. The method ofclaim 4, wherein the CVD process uses a Ru₃CO₁₂ precursor.
 6. The methodof claim 4, wherein a deposition temperature for the CVD process iswithin a range of about 100-200 degrees Celsius.
 7. The method of claim1, wherein the metal material comprises at least one of: ruthenium,tungsten, cobalt, and copper.
 8. The method of claim 1, wherein aprofile of the via has an angle that is greater than 85 degrees withrespect to a top surface of the first conductive feature.
 9. The methodof claim 1, wherein a width of the via is greater than a width of thesecond conductive feature.
 10. A method comprising: forming a firstdielectric layer on a substrate; in a first process, forming a viawithin the first dielectric layer, the via formed of a metal material;performing a Chemical Mechanical Polishing process to a top surface ofthe via; forming a second dielectric layer on the first dielectric layerand the via; forming a trench in the second dielectric layer thatexposes the via; and in a second process that is different than thefirst process, forming the metal material within the trench to form aconductive feature within the trench such that the metal materialcompletely fills the trench and physically contacts the via, wherein themetal material of the conductive feature is formed within the trenchwithout a barrier layer being disposed within the trench prior to theforming of the metal material within the trench to form the conductivefeature.
 11. The method of claim 10, wherein a diameter of the via islarger than a width of the conductive feature.
 12. The method of claim10, wherein a bottom of the via is in direct contact with a gatefeature.
 13. The method of claim 10, wherein a bottom of the via is indirect contact with a S/D feature.
 14. The method of claim 10, whereinthe via is in direct contact with the first dielectric layer and theconductive feature is in direct contact with the second dielectriclayer.
 15. The method of claim 10, wherein a diameter of the via issmaller than a width of the conductive feature.
 16. The method of claim10, wherein a diameter of the via is approximately equal to a width ofthe conductive feature.
 17. A method comprising: forming a firstdielectric layer on a substrate; forming a first conductive featurewithin the first dielectric layer, the first conductive feature formedof a metal material; forming a second dielectric layer over the firstconductive feature; forming a third dielectric layer over the seconddielectric layer, the third dielectric layer formed of a differentmaterial than the second dielectric layer; forming a first trenchextending through the second and third dielectric layers to expose thefirst conductive feature; forming, by a first process, the metalmaterial in the first trench to form a via, wherein the metal materialcompletely fills the first trench and physically contacts the firstconductive feature and the second and third dielectric layers; andforming a fourth dielectric layer over the third dielectric layer;forming a second trench extending through the fourth dielectric layer toexpose the via, and forming, by a second process that is different thanthe first process, the metal material within the second trench to form asecond conductive feature, wherein the metal material completely fillsthe second trench and physically contacts the via and the fourthdielectric layer, wherein the metal material is formed within the secondtrench without a barrier layer being disposed within the second trenchprior to the forming of the metal material within the second trench. 18.The method of claim 17, wherein a width of the via is greater than awidth of the second conductive feature.
 19. The method of claim 17,wherein the fourth dielectric layer is formed of a different materialthan the second and third dielectric layers.
 20. The method of claim 17,wherein the first conductive feature has a top surface facing away fromthe substrate, and wherein the second dielectric layer physicallycontacts the top surface of the first conductive feature after theforming of the metal material in the first trench to form the via.